Extending the storage life of stencil printed wafers for small die size on wafer mounting tape

@article{Chung2012ExtendingTS,
  title={Extending the storage life of stencil printed wafers for small die size on wafer mounting tape},
  author={Ee Lin Chung and Eric Erfe},
  journal={2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)},
  year={2012},
  pages={1-5}
}
One of the most recent developments in die attach adhesive technology comes in the form of Wafer Backside Coating (WBC) materials. These new materials overcome the perennial manufacturability issues with traditional dispense paste such as inconsistent fillet height and width, die tilt, insufficient coverage, etc. But unlike traditional dispense pastes, these WBC materials need to be stencil printed at the back of a wafer, b-staged cured and then mounted onto a wafer mounting tape. However… CONTINUE READING