Experimental wetting dynamics study of eutectic and lead-free solders varying flux, temperature and surface finish metallization

@article{Kang2004ExperimentalWD,
  title={Experimental wetting dynamics study of eutectic and lead-free solders varying flux, temperature and surface finish metallization},
  author={Suk Chae Kang and Chunho Kim and James A. Muncy and Mathias Falck Schmidt and Davarian L. Baldwin},
  journal={IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585)},
  year={2004},
  pages={56-63}
}
Demands on solder bump interconnects have increased in modern electronics this is characterized by high density, small size and fine pitch devices. In solder bump interconnects, solder wetting onto bond pads is the key factor that determines the interconnect process yield and the solder joint reliability. Solder wetting involves various physical phenomena such as surface tension imbalance, viscous dissipation, molecular kinetic motion, chemical reactions and diffusion. In this paper, an… CONTINUE READING

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