Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon

@article{Moon2004ExperimentalSO,
  title={Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon},
  author={Seok Hwan Moon and Gunn Hwang and Sang Choon Ko and Youn Tae Kim},
  journal={Microelectronics Reliability},
  year={2004},
  volume={44},
  pages={315-321}
}
The electronic industries have been tried to develop the electronic packaging technology for high-density, light weight, and miniaturization of mobile personal information terminals such as notebook PC, personal digital assistant (PDA), or handheld PC as the performance and the portability of the system have been become important more and more. The generated heat from the CPU of the electronic system should be dissipated effectively for the stability in operation and the long life-time of the… CONTINUE READING

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