Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers

Glass has been proposed to be an ideal material for interposers to address the limits of both organic and silicon, except for its poor thermal conductivity compared to silicon. This paper proposes to use large number of copper through package vias (TPVs) that can be fabricated at low cost to improve this shortcoming. We report on experimental fabrication… (More)