Experimental damage mechanics of microelectronic solder joints under fatigue loading

@article{Basaran2005ExperimentalDM,
  title={Experimental damage mechanics of microelectronic solder joints under fatigue loading},
  author={Cemal Basaran and Huan Tang and Shihua Nie},
  journal={Proceedings Electronic Components and Technology, 2005. ECTC '05.},
  year={2005},
  pages={874-881 Vol. 1}
}
Fatigue damage is a progressive process of material degradation. The objective of this study is to experimentally qualify the damage mechanism in solder joints in electronic packaging under thermal fatigue loading. Another objective of this paper is to show that damage mechanism under thermal cycling and mechanical cycling is very different. Elastic modulus degradation under thermal cycling, which is considered as a physically detectable quantity of material degradation, was measured by nano… CONTINUE READING
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