Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling

@inproceedings{Falsetti2018ExperimentalCO,
  title={Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling},
  author={Chiara Falsetti},
  year={2018}
}
The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integration, which consists of single dies stacked and connected by means of Through-Silicon-Vias (TSVs), is a promising architecture, but it is hampered by the requirement of finding innovative and more effective cooling technology for dissipating… CONTINUE READING

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