Experimental and numerical assessment of adhesion in real-life MEMS


The goal of this research is to measure the adhesion energy in experimental devices which are as alike as possible to real-life MEMS and to provide a sound basis for numerical methods which could predict the adhesion energy in various situations. In this way, a better knowledge of adhesion properties is obtained, possibly entailing deeper miniaturization and higher optimization of microstructures. The paper describes the innovative experimental measurements which have been carried out and the comparison with numerical outcomes via Finite Element Method (FEM).

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@article{Ardito2012ExperimentalAN, title={Experimental and numerical assessment of adhesion in real-life MEMS}, author={R. Ardito and Leonardo Baldasarre and Alberto Corigliano and B. De Masi and A. Frangi and Luca Magagnin}, journal={2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems}, year={2012}, pages={1/6-6/6} }