Deformation of silicon - Insights from micro compression testing at 25-500°C
- S. Korte, Barnard, +4 authors WJ
- Int. J. Plasticity,
The goal of this research is to measure the adhesion energy in experimental devices which are as alike as possible to real-life MEMS and to provide a sound basis for numerical methods which could predict the adhesion energy in various situations. In this way, a better knowledge of adhesion properties is obtained, possibly entailing deeper miniaturization and higher optimization of microstructures. The paper describes the innovative experimental measurements which have been carried out and the comparison with numerical outcomes via Finite Element Method (FEM).