Experimental Investigations on Board Level Electronic Packages Subjected to Sinusoidal Vibration Loads

@article{Sakri2013ExperimentalIO,
  title={Experimental Investigations on Board Level Electronic Packages Subjected to Sinusoidal Vibration Loads},
  author={M. Sakri},
  journal={International Journal of Current Engineering and Technology},
  year={2013},
  volume={2},
  pages={427-431}
}
  • M. Sakri
  • Published 2013
  • Materials Science
  • International Journal of Current Engineering and Technology
The lead wires and solder joints of surface mounted sensitive electronic components are more prone to failures due to vibration environments and leads to malfunctioning of electronic system. In this work a Plastic Small Outline Package (PSOP) and Printed Circuit Board (PCB) assembly is used as a test vehicle and subjected to sinusoidal vibrations by mounting the PCB assembly on conventional Nylon spacers. Then, the assembly is subjected to a constant input acceleration of 0.5G. Small input… Expand
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