Excellent reliability with high throughput techniques and materials for alloy attachment

@article{Pavio1989ExcellentRW,
  title={Excellent reliability with high throughput techniques and materials for alloy attachment},
  author={Jeanne S. Pavio},
  journal={IEEE MTT-S International Microwave Symposium Digest},
  year={1989},
  pages={761-764 vol.2}
}
An evaluation is presented which comprehensively examines alloys which can be utilized for secondary attachment in microwave modules. After reflow, the evaluation cycle encompassed in 168-h bake operation, thermal cycling, and mechanical vibration and shock. The samples were X-rayed, examined visually for wetting anomalies, and microsectioned to analyze intermetallic formation. All alloys tested were reflowed without flux in a reducing atmosphere reflow furnace, a high-throughput process… CONTINUE READING

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