Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests

Abstract

Failure mechanisms of lead-free solder interconnections in power cycling and thermal shock tests have been investigated in this work. Even though there are some characteristic differences between the two tests, the failures in both cases were induced by recrystallizationassisted crack nucleation and propagation. The three major differences between the tests… (More)
DOI: 10.1016/j.microrel.2006.07.095

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12 Figures and Tables