Evolution and outlook of TSV and 3D IC/Si integration

@article{Lau2010EvolutionAO,
  title={Evolution and outlook of TSV and 3D IC/Si integration},
  author={John H. Lau},
  journal={2010 12th Electronics Packaging Technology Conference},
  year={2010},
  pages={560-570}
}
  • John H. Lau
  • Published 2010 in
    2010 12th Electronics Packaging Technology…
3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and in general the TSV (through-silicon via) separates 3D IC packaging from 3D IC integration and 3D Si integration since the latter two use TSV but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D Si integration and 3D IC integration and is the focus of this investigation. The origin of 3D Si… CONTINUE READING
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Design and Process of 3D MEMS Packaging

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