Etching of transparent materials by laser ablation of an organic solution

Abstract

Transparent materials such as fused silica and quartz crystal were etched upon irradiation of an organic solution containing pyrene, using a conventional KrF or XeCl excimer laser. Threshold fluence for etching was 240mJ/cm for fused silica, which was remarkably low compared with that of direct ablation using conventional lasers. The etch rates depended on… (More)

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Cite this paper

@inproceedings{Wang2001EtchingOT, title={Etching of transparent materials by laser ablation of an organic solution}, author={Jun Wang and Hiroyuki Niino and Akira Yabe}, year={2001} }