## Fast ${\cal H}$ -Matrix-Based Direct Integral Equation Solver With Reduced Computational Cost for Large-Scale Interconnect Extraction

- Wenwen Chai, Dan Jiao
- IEEE Transactions on Components, Packaging and…
- 2013

Highly Influential

- Published 2018 in IEEE Transactions on Microwave Theory and…

The equivalent surface impedance (ESI)-based mixed potential integral equation (MPIE) is proposed in this paper for parameter extraction of 3-D interconnects. Boundary integral equations (BIEs) describing the conductor region and the nonconductor region are utilized to derive the ESI model, which incorporates with an MPIE to simplify the electromagnetic… CONTINUE READING

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