# Equivalent Surface Impedance-Based Mixed Potential Integral Equation Accelerated by Optimized $\cal {H}$ -Matrix for 3-D Interconnects

• Published 2018 in
IEEE Transactions on Microwave Theory and…
The equivalent surface impedance (ESI)-based mixed potential integral equation (MPIE) is proposed in this paper for parameter extraction of 3-D interconnects. Boundary integral equations (BIEs) describing the conductor region and the nonconductor region are utilized to derive the ESI model, which incorporates with an MPIE to simplify the electromagnetic… CONTINUE READING