Entanglement across separate silicon dies in a modular superconducting qubit device

@article{Gold2021EntanglementAS,
  title={Entanglement across separate silicon dies in a modular superconducting qubit device},
  author={Alysson Gold and J.-P. Paquette and Anna Stockklauser and Matthew Reagor and M. Sohaib Alam and Andrew J Bestwick and Nicolas Didier and Ani Nersisyan and Feyza B. Oruç and Armin Razavi and Ben Scharmann and Eyob A. Sete and Biswajit Sur and Davide Venturelli and Cody James Winkleblack and Filip A. Wudarski and M. Harburn and Chad T. Rigetti},
  journal={npj Quantum Information},
  year={2021},
  volume={7},
  pages={1-10}
}
Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated… 

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