Enhanced thermal measurements of high power LEDs by junction characteristic

Abstract

The measurements of junction temperature rise and thermal resistance of power LEDs by junction characteristic are proposed in this paper. The measured thermal resistance is corrected by the light-absorbing method. It is also proved that the physical meaning of the electrical average temperature rise of series LED array system is the arithmetic mean of the… (More)

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@article{Ge2010EnhancedTM, title={Enhanced thermal measurements of high power LEDs by junction characteristic}, author={Chenning Ge and Shiwei Feng and Guangchen Zhang and Kaikai Ding and Peifeng Hu and Haitao Deng}, journal={2010 International Workshop on Junction Technology Extended Abstracts}, year={2010}, pages={1-4} }