Enhanced Optical and Thermal Performance of Eutectic Flip-Chip Ultraviolet Light-Emitting Diodes via AlN-Doped-Silicone Encapsulant

Abstract

This paper investigated the optical and thermal performance of the nitride-based ultraviolet light-emitting diodes fabricated by the eutectic flip-chip method. A new packaging structure was proposed by introducing a thin encapsulation layer doped with 0.4 wt% AlN nanoparticles (NPs) and uniform quartz lens simultaneously. Experimental results showed that… (More)

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