Engineered Nanostructures for High Thermal Conductivity Substrates

  title={Engineered Nanostructures for High Thermal Conductivity Substrates},
  author={Kripa K Varanasi and Tao Deng and Pramod Chamarthy and Shakti Chauhan and Peter de Bock and Ambarish Kulkarni and Gary Mandrusiak and Brian Rush and Boris Russ and Lauraine Denault and Stanton E. Weaver and Frank Gerner and Quinn Leland and Kirk L. Yerkes},
The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. ABSTRACT In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal expansion matched heat spreader that is capable of moving heat from multiple… CONTINUE READING