Enabling technologies for multi-chip integration using Proximity Communication

@article{Chow2009EnablingTF,
  title={Enabling technologies for multi-chip integration using Proximity Communication},
  author={Alex Chow and David Hopkins and Robert Drost and Ron Ho},
  journal={2009 International Symposium on VLSI Design, Automation and Test},
  year={2009},
  pages={39-42}
}
Proximity Communication enables high-performance multi-chip packages by providing high-bandwidth, low-power, and low-latency chip-to-chip I/O. Chips are placed face-to-face, with only a few microns of separation, such that overlapping transceiver circuits can send and receive signals through capacitive or inductive coupling. Packaging chips in this way, however, presents a number of physical challenges. The multi-chip package must hold and maintain the chips in precise alignment. This paper… CONTINUE READING