Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules

@article{Caro2011EnablingCC,
  title={Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules},
  author={A. Maestre Caro and Y. Travaly and G. Maes and G. Borghs and S. Armini},
  journal={2011 IEEE International Interconnect Technology Conference},
  year={2011},
  pages={1-3}
}
  • A. Maestre Caro, Y. Travaly, +2 authors S. Armini
  • Published 2011
  • Materials Science
  • 2011 IEEE International Interconnect Technology Conference
  • Two different material-selective Self assembled monolayers (SAMs) were successfully deposited on Cu and SiO2 structures that mimic the Dual Damascene integration scheme. A two-step SAM coating process is presented. First, a “sacrificial” SAM is deposited at the Cu bottom and secondly, a “barrier” SAM at the SiO2 surface. The order in the SAMs deposition sequence and the differential thermal release of the thiol “sacrificial” SAM vs. the amino “barrier” SAM, allows an oxide-free Cu-to-Cu… CONTINUE READING

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