Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
@article{Caro2011EnablingCC, title={Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules}, author={A. Maestre Caro and Y. Travaly and G. Maes and G. Borghs and S. Armini}, journal={2011 IEEE International Interconnect Technology Conference}, year={2011}, pages={1-3} }
Two different material-selective Self assembled monolayers (SAMs) were successfully deposited on Cu and SiO2 structures that mimic the Dual Damascene integration scheme. A two-step SAM coating process is presented. First, a “sacrificial” SAM is deposited at the Cu bottom and secondly, a “barrier” SAM at the SiO2 surface. The order in the SAMs deposition sequence and the differential thermal release of the thiol “sacrificial” SAM vs. the amino “barrier” SAM, allows an oxide-free Cu-to-Cu… CONTINUE READING
References
SHOWING 1-9 OF 9 REFERENCES
Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2‐Derived Self‐Assembled Monolayers
- Materials Science
- 2010
- 35
Gold nanoparticulate film bound to silicon surface with self-assembled monolayers
- Materials Science
- 1998
- 40
Self-assembled monolayers: from 'simple' model systems to biofunctionalized interfaces
- Materials Science
- 2004
- 308
- PDF
Dissociation of ammonia on a copper surface and the effect of oxygen coadsorption: a quantum-chemical study
- Chemistry
- 1993
- 21
- PDF
Patent 2006/0128142 A1
- European Patent 1
- 2006
Lara A
- stroff, Jennah K. Kriebel, Ralph G. Nuzzo and George M. Whitesides, “Self assembled monolayers of thiolates on Metals as a form of nanotechnology”, Chemical reviews, Vol. 105
- 2005
Self-assembled monolayers of thiolates on metals as a form of nanotechnology.
- Chemistry, Medicine
- Chemical reviews
- 2005
- 6,049
- PDF
Applied Physics Letters
- Vol. 69
- 1996