Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
@article{MaestreCaro2011EnablingCC, title={Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules}, author={A. Maestre Caro and Youssef Travaly and Guido Maes and Gustaaf Borghs and Silvia Armini}, journal={2011 IEEE International Interconnect Technology Conference}, year={2011}, pages={1-3} }
Two different material-selective Self assembled monolayers (SAMs) were successfully deposited on Cu and SiO2 structures that mimic the Dual Damascene integration scheme. A two-step SAM coating process is presented. First, a “sacrificial” SAM is deposited at the Cu bottom and secondly, a “barrier” SAM at the SiO2 surface. The order in the SAMs deposition sequence and the differential thermal release of the thiol “sacrificial” SAM vs. the amino “barrier” SAM, allows an oxide-free Cu-to-Cu…
References
SHOWING 1-9 OF 9 REFERENCES
Gold nanoparticulate film bound to silicon surface with self-assembled monolayers
- Chemistry, Physics
- 1998
Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2‐Derived Self‐Assembled Monolayers
- Materials Science
- 2010
A 3‐aminopropyltrimethoxysilane‐derived self‐assembled monolayer (NH2SAM) is investigated as a barrier against copper diffusion for application in back‐end‐of‐line (BEOL) technology. The essential…
Self-assembled monolayers: from 'simple' model systems to biofunctionalized interfaces
- Physics
- 2004
We review recent developments in the area of self-assembled monolayers (SAMs) and their applications. First, we discuss issues related to the structure, the phase transitions, the phase diagram, and…
Gas‐phase transport of WF6 through annular nanopipes in TiN during chemical vapor deposition of W on TiN/Ti/SiO2 structures for integrated circuit fabrication
- Physics
- 1996
Delamination of TiN/Ti bilayers on SiO2 is a serious problem during W chemical vapor deposition (CVD) using WF6 to form vertical interconnects in integrated circuits. In order to obtain insight into…
Dissociation of ammonia on a copper surface and the effect of oxygen coadsorption: a quantum-chemical study
- Chemistry
- 1993
Patent 2006/0128142 A1
- European Patent 1
- 2006
Lara A
- stroff, Jennah K. Kriebel, Ralph G. Nuzzo and George M. Whitesides, “Self assembled monolayers of thiolates on Metals as a form of nanotechnology”, Chemical reviews, Vol. 105
- 2005
Self-assembled monolayers of thiolates on metals as a form of nanotechnology.
- ChemistryChemical reviews
- 2005
Applied Physics Letters
- Vol. 69
- 1996