Enablers of robust sub-40 micrometer ultra fine pitch ball bonding

Abstract

As device manufacturers execute their roadmaps, die shrinks are leading to progressively finer bond pad pitches with consequently smaller bond pad openings on which first bonds are placed. Bond pad pitches as low as 40 micrometers are currently in production with near-term roadmaps pushing to 35 micrometers and below. Based on statistical process capability… (More)

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