Emerging Directions For Packaging Technologies 62 Emerging Directions For Packaging Technologies

@inproceedings{Mahajan2002EmergingDF,
  title={Emerging Directions For Packaging Technologies 62 Emerging Directions For Packaging Technologies},
  author={Ravi Mahajan},
  year={2002}
}
The continual increasing performance of microelectronics products places a high demand on packaging technologies. Key drivers such as thermal management, power delivery, interconnect density, and integration require novel material development and new package architectures. In this paper, package technology migrations for microprocessors and communication products are described. Material needs for high thermal dissipation, high-speed signaling, and high-density interconnects are discussed… CONTINUE READING
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