Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

@article{Mahajan2016EmbeddedMI,
  title={Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect},
  author={Ravi Mahajan and Robert Sankman and Neha Patel and Dae-Woo Kim and Kemal Aygun and Zhiguo Qian and Yidnekachew S. Mekonnen and Islam A. Salama and Sujit Sharan and Deepti Iyengar and Debendra Mallik},
  journal={2016 IEEE 66th Electronic Components and Technology Conference (ECTC)},
  year={2016},
  pages={557-565}
}
The EMIB dense MCP technology is a new packaging paradigm that provides localized high density interconnects between two or more die on an organic package substrate, opening up new opportunities for heterogeneous on-package integration. This paper provides an overview of EMIB architecture and package capabilities. First, EMIB is compared with other approaches for high density interconnects. Some of the inherent advantages of the technology, such as the ability to cost effectively implement high… CONTINUE READING
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