Electroosmotic pump using a porous frit for cooling the integrated circuit stack

@inproceedings{2004ElectroosmoticPU,
  title={Electroosmotic pump using a porous frit for cooling the integrated circuit stack},
  author={ヴ,クアット and キム,サラ and マイアーズ,アラン and マヴィーティ,ジェイムズ and リスト,スコット,アール},
  year={2004}
}
Stack of the heat generating integrated circuit chip can be provided with a cooling integrated circuit chip interposed. Cooling integrated circuit chip may have a micro-channel for flow of cooling fluid. The cooling fluid can be pumped by using an integrated electroosmotic pump. Removal of the cooling fluid gas is accomplished using integrated recombines in some embodiments.