Electromigration testing of wire bonds

@article{Hook2014ElectromigrationTO,
  title={Electromigration testing of wire bonds},
  author={Michael Hook and Di Erick Xu and Michael Mayer},
  journal={2014 IEEE 27th Canadian Conference on Electrical and Computer Engineering (CCECE)},
  year={2014},
  pages={1-6}
}
Wire bonding is the dominant first-level interconnection technology for packaging of microelectronics. This paper presents the results of testing silver and gold wire bonds for electromigration with substrate temperatures from 100 degrees Celsius to over 200 degrees Celsius. Wire resistances were measured during testing, and, following testing, the wires were imaged by optical and scanning electron microscopy. Silver wires withstood 4 × 105 amperes per square centimeter for 180 hours at a peak… CONTINUE READING

References

Publications referenced by this paper.