## A.”Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects,

- Tan, .M C, Roy
- Thin Solid Films,
- 2006

@article{Chen2008ElectromigrationSW, title={Electromigration simulation with consideration of the atomic concentration gradient}, author={Xuefan Chen and Lihua Liang and Yong Liu}, journal={2008 International Conference on Electronic Packaging Technology & High Density Packaging}, year={2008}, pages={1-7} }

- Published 2008 in 2008 International Conference on Electronic…

An enhanced finite element modeling methodology based on commercial software ANSYS Multi-physics and FORTRAN code is developed for the simulation of electromigration. The electronic migration formulation taking into account the effects of the atomic concentration gradient (ACG) has been developed to show the difference in the electromigration (EM) failure… CONTINUE READING

### Presentations referencing similar topics