Electromigration reliability of redistribution lines in wafer-level chip-scale packages

@article{Kao2011ElectromigrationRO,
  title={Electromigration reliability of redistribution lines in wafer-level chip-scale packages},
  author={Chin-Li Kao and Tei-Chen Chen and Yi-Shao Lai and Ying-Ta Chiu},
  journal={2011 IEEE 61st Electronic Components and Technology Conference (ECTC)},
  year={2011},
  pages={326-331}
}
Wafer-level chip-scale packages (WLCSPs) have become subject to the same drive for miniaturization as all electronic packages. The I/O count is increasing and ball pitch is shrinking at the expense of trace pitch and in turn, current densities are increasing. This leads to current crowding and Joule heating in the vicinity of solder joints and under bump metallurgy (UBM) structures where resistance values change significantly. These phenomena are responsible for structural damage of… CONTINUE READING

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