Electromigration reliability issues in dual-damascene Cu interconnections

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@article{Ogawa2002ElectromigrationRI, title={Electromigration reliability issues in dual-damascene Cu interconnections}, author={Ennis T. Ogawa and Ki-Don Lee and Volker A. Blaschke and Paul S. Ho}, journal={IEEE Trans. Reliability}, year={2002}, volume={51}, pages={403-419} }