Electromigration reliability issues in dual-damascene Cu interconnections

@article{Ogawa2002ElectromigrationRI,
  title={Electromigration reliability issues in dual-damascene Cu interconnections},
  author={Ennis T. Ogawa and Ki-Don Lee and Volker A. Blaschke and Paul S. Ho},
  journal={IEEE Trans. Reliability},
  year={2002},
  volume={51},
  pages={403-419}
}
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