Electromigration in solder joints and solder lines

@article{Gan2002ElectromigrationIS,
  title={Electromigration in solder joints and solder lines},
  author={Hua Yang. Gan and Woo jeon Choi and Gu Xu and K. N. Tu},
  journal={JOM},
  year={2002},
  volume={54},
  pages={34-37}
}
Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-grooves etched on Si (001). This article discusses the results… CONTINUE READING

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