Electromigration in SnPb and Pb-free solder bumps

@article{Rinne2003ElectromigrationIS,
  title={Electromigration in SnPb and Pb-free solder bumps},
  author={G. Rinne},
  journal={2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)},
  year={2003},
  volume={1},
  pages={974-978 Vol.1}
}
Electromigration is the movement of metal atoms in the direction of current flow. It is caused by the transfer of momentum from the passing electrons to atoms in the lattice. First discovered in thin-film aluminum conductors some thirty years ago, electromigration is a significant concern for solder bumps on chip scale packages (CSP). As the understanding of solder electromigration expands, new opportunities for risk mitigation have emerged. This paper addresses the physics of electromigration… CONTINUE READING

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