Electromigration in Flip-chip solder joints

@article{Chen2006ElectromigrationIF,
  title={Electromigration in Flip-chip solder joints},
  author={Chih Hao Chen},
  journal={2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings},
  year={2006},
  pages={2121-2124}
}
  • Chih Hao Chen
  • Published 2006 in
    2006 8th International Conference on Solid-State…
With the portable devices becoming smaller and more compact in size, flip-chip technology has been adopted for fine-pitch packaging in microelectronics industry. Area array of tiny solder joints can be fabricated on Si chips to achieve high-density packaging. In addition, as the required performance continues to increase, the input/output (I/O) pin count of flip-chip products has dramatically increased and the current that each bump needs to carry continues to increase, resulting in higher… CONTINUE READING
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