Electromigration effect on Cu-pillar(Sn) bumps

@article{Lee2005ElectromigrationEO,
  title={Electromigration effect on Cu-pillar(Sn) bumps},
  author={Sang Myung Lee and Y. X. Guo and C. K. Ong},
  journal={2005 7th Electronic Packaging Technology Conference},
  year={2005},
  volume={1},
  pages={5 pp.-}
}
Increased current density per bump is inevitable with the growing demand for miniaturization. Hence, the electromigration failure mode of bumps is critical to determine the bump current carrying capability. This paper presents the electromigration failure study of the copper pillar (Cu-pillar) bump and compared to that of the solder bumps. Our analysis shows that the Cu-pillar bump could handle higher current which is attributed to its unique structure. Conducted experiment shows that the… CONTINUE READING

Similar Papers

Citations

Publications citing this paper.
SHOWING 1-10 OF 12 CITATIONS

Electromigration reliability of cylindrical Cu pillar SnAg3.0Cu0.5 bumps

  • 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  • 2014
VIEW 4 EXCERPTS
CITES BACKGROUND
HIGHLY INFLUENCED

The impact and performance of electromigration on fine pitch Cu pillar with different bump structure for flip chip packaging

  • 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
  • 2015
VIEW 1 EXCERPT
CITES BACKGROUND

Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
  • 2011
VIEW 1 EXCERPT
CITES BACKGROUND

The study on the shaping of electroplated copper pillar bumping

  • 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging
  • 2011

Electromigration of Cu-Sn-Cu micropads in 3D interconnect

  • 2008 58th Electronic Components and Technology Conference
  • 2008

References

Publications referenced by this paper.
SHOWING 1-10 OF 12 REFERENCES

Unique phase changes induced by electromigration (EM) in solder joints

  • 53rd Electronic Components and Technology Conference, 2003. Proceedings.
  • 2003
VIEW 4 EXCERPTS
HIGHLY INFLUENTIAL

Electromigration in SnPb and Pb-free solder bumps

  • 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
  • 2003
VIEW 1 EXCERPT

Recent Advances on Electromigration in very-large-scale-integration of interconnects

K. N. Tu
  • J. Appl. Phys, Vol 94, No. 9 (2003), pp. 5461 - 5472.
  • 2003
VIEW 2 EXCERPTS

The Science and Engineering of Microelectronic Fabrication

A Stephen, Campbell
  • 2001
VIEW 1 EXCERPT