Electromigration characterization of lead-free flip-chip bumps for 45nm technology node


We have conducted electromigration experiments on lead-free SnAg flip-chip bump interconnection for 45nm technology node. We report lifetime distributions, kinetic parameters and intermetallic compound formation. Further, we discuss the impact of Ag-concentration as well as current direction on the electromigration reliability of these flip-chip bumps… (More)


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