Electromigration and Thermal Storage Study of Barrierless Co Vias

@article{Pedreira2018ElectromigrationAT,
  title={Electromigration and Thermal Storage Study of Barrierless Co Vias},
  author={O. Varela Pedreira and K. Croes and Houman Zahedmanesh and Kevin Vandersmissen and Marleen H. van der Veen and Victor Vega Gonzalez and Dries Dictus and Larry Zhao and A. Kolies and Zs. Tőkei},
  journal={2018 IEEE International Interconnect Technology Conference (IITC)},
  year={2018},
  pages={48-50}
}
We study the reliability performance in terms of electromigration and thermal storage of barrierless Co vias. While for our reference with Cu filled vias and a TaNCo barrier/liner system we did observe voids in some vias after electromigration, these voids were not observed for the Co vias and thus the studied system is more scalable towards smaller vias. Long thermal storage measurements show more failures in barrierless Co vias. As this problem is linked to a weak Co/dielectric interface and… CONTINUE READING

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