Electromigration Failure Distributions of Cu/Low-$k$ Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology

  title={Electromigration Failure Distributions of Cu/Low-\$k\$  Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology},
  author={A. S. Oates and M. H. Lin},
  journal={IEEE Transactions on Device and Materials Reliability},
We examine the effects of void morphology and critical current density (jc) on the electromigration failure distributions of Cu/low-k dual-damascene vias. Cu dual-damascene vias exhibit multiple modes of electromigration-induced voiding, and reliability is strongly dependent on the morphology of voids. We have developed a model of failure for dc and pulsed dc currents that allows prediction of failure time distributions for vias, taking into account void morphology. We obtain good agreement… CONTINUE READING
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