Electromigration Failure Distributions of Cu/Low-$k$ Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology

@article{Oates2009ElectromigrationFD,
  title={Electromigration Failure Distributions of Cu/Low-\$k\$  Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology},
  author={A. S. Oates and M. H. Lin},
  journal={IEEE Transactions on Device and Materials Reliability},
  year={2009},
  volume={9},
  pages={244-254}
}
We examine the effects of void morphology and critical current density (jc) on the electromigration failure distributions of Cu/low-k dual-damascene vias. Cu dual-damascene vias exhibit multiple modes of electromigration-induced voiding, and reliability is strongly dependent on the morphology of voids. We have developed a model of failure for dc and pulsed dc currents that allows prediction of failure time distributions for vias, taking into account void morphology. We obtain good agreement… CONTINUE READING
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Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures

  • A. V. Vairagar, S. G. Mhaisalkar, +4 authors A. M. Gusak
  • Appl. Phys. Lett., vol. 87, no. 8, p. 081 909…
  • 2005
1 Excerpt

Examination of critical length effect in copper interconnects with oxide and low-k dielectrics

  • S. Thrasher, M. Gall, +4 authors H. Kawasaki
  • Proc. 7th Int. Workshop Stress-Induced Phenom…
  • 2004
1 Excerpt

Effect of liner thickness on electromigration lifetime

  • E. G. Liniger, C. K. Hu, L. M. Gignac, A. Simon
  • J. Appl. Phys., vol. 93, no. 12, pp. 9576–9582…
  • 2003
1 Excerpt

Process optimization—The key to obtain highly reliable Cu interconnects

  • A. H. Fischer, A. von Glasow, S. Penka, F. Ungar
  • Proc. IITC, 2003, pp. 253–255.
  • 2003
1 Excerpt

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