Electromagnetic noise mitigation in high-speed printed circuit boards and packaging using electromagnetic band gap structures

@article{Shahparnia2004ElectromagneticNM,
  title={Electromagnetic noise mitigation in high-speed printed circuit boards and packaging using electromagnetic band gap structures},
  author={Shahrooz Shahparnia and B.. Mohajer-Iravani and O. M. Ramahi},
  journal={2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)},
  year={2004},
  volume={2},
  pages={1831-1836 Vol.2}
}
In this work, we discuss the novel concept of using metallo-dielectric electromagnetic bandgap (EBG) structures to address critical electromagnetic noise problems in high-speed circuits, packages and boards. Various design techniques for these structures, when embedded in a parallel metallic-plate structure, are presented and their efficacy and preciseness are compared. An accurate physics-based model for the unit cell of these surfaces is introduced and its accuracy is compared with… CONTINUE READING

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