Electromagnetic modeling methodologies and design challenges of packages for 6.4-12.8 Gbps chip-to-chip interconnects

Abstract

In order to predict and optimize the performance of high-speed digital systems, it Is essential to accurately model the interconnect systems. The traditional method of analyzing interconnects by decomposing the structure into subsections and representing them by circuit parameters calculated using quasistatic electromagnetic solvers loses accuracy at higher… (More)

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@article{Beyene2004ElectromagneticMM, title={Electromagnetic modeling methodologies and design challenges of packages for 6.4-12.8 Gbps chip-to-chip interconnects}, author={W. T. Beyene and H. Shi and Jun Feng and X. Yuan}, journal={IEEE Antennas and Propagation Society Symposium, 2004.}, year={2004}, volume={3}, pages={3325-3328 Vol.3} }