Electromagnetic interference (EMI) behavior of system in package ( SIP)

We first report the electromagnetic interference (EMI) behavior of a system in package (SIP), consisting of MCU, NAND flash memory, SDRAM and printed circuit board (PCB) substrate, in comparison to the discrete PCB with individual integrated circuits (IC) mounted on a system board. RF current scanning, transverse electromagnetic (TEM) cell and semi-anechoic… CONTINUE READING