Electromagnetic induced heating for rapid thermal cycling of single SnAgCu solder joint in double substrates


The thermal fatigue behavior of the solder joint treated by electromagnetic induced heating is investigated in the present study. The microstructures and compositions of solder joints were observed and analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray system (EDXS) respectively. An approach to rapid thermal cycles by high-frequency… (More)

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