Electromagnetic Modeling of Packaging Layout in Power Electronic Modules

  title={Electromagnetic Modeling of Packaging Layout in Power Electronic Modules},
  author={Kalyan Siddabattula},
ii Acknowledgements iii 


Publications citing this paper.


Publications referenced by this paper.
Showing 1-10 of 10 references

Characterization of Power Electronics System Interconnect Parasitics Using Time Domain Reflectometry

  • Huibin Zhu, Allen Hefner, Jih-Sheng Lai
  • IEEE Transactions on Power Electronics,
  • 1999
Highly Influential
4 Excerpts

An innovative technique for packaging Power Electronic Building Blocks using Metal Post Interconnected Parallel Plate Structure

  • Shatil Haque
  • IEEE-CPMT Transactions Part B,
  • 1999
1 Excerpt

Multi Layer Integration Technology for Packaging of IPEM

  • Zhexian Liang, Guo-Quan Lu, Dusan Borojevic, Fred C. Lee
  • VPEC Seminar
  • 1999
1 Excerpt

Conducted EMI analysis of a boost PFC circuit,

  • W. Zhang
  • in Proc. IEEE Applied Power electronics Conf.,
  • 1998
1 Excerpt

Modeling of parasitic inductive effects in power modules

  • E. Falck, M. Stoisiek, G. Wachutka
  • Proc. IEEE Int. Symp. Power Semiconductor Devices…
  • 1997
1 Excerpt

MOSFET switching behaviour under influence of PCB stray inductance”,in

  • W. Tuelings, J. L. Schanen, J. Roudet
  • Conf. Rec. IEEE Industry Applications Soc. Annu…
  • 1996

Modeling of low inductance busbar connections

  • J. L. Schanen, E. Clavel, J. Roudet
  • IEEE Ind. Applicat. Mag., pp 39-43, Sept/Oct 1996…
  • 1996

High frequency, low cost, power packaging using thick film power overlay technology

  • Fisher
  • Proc. Of APEC
  • 1995
1 Excerpt

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