Electromagnetic Emission Analysis for IC Packaging Structures

Abstract

The IC packaging EMC/SI/PI problems have been broadly attested while its electromagnetic emissions are becoming increasingly significant as the data rate of digital system continues increasing. This paper focuses on EM emission behaviors for IC packaging structures. It is found that packaging EMI demonstrates clearly low and high frequency behaviors. Both theoretical analysis based on the first principle asymptotic forms and simulated results based on numerical full wave solvers are provided to investigate critical impacts to IC packaging EM radiation. It provides a basic modeling for comprehensive radiation studies. All modeling analysis in this paper contributes to the low EMI design rule development.

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Cite this paper

@inproceedings{Huang2014ElectromagneticEA, title={Electromagnetic Emission Analysis for IC Packaging Structures}, author={Nick K. H. Huang and Li Jun Jiang}, year={2014} }