Corpus ID: 55497611

Electroless Nickel / Electroless Palladium / Immersion Gold Plating Process for Gold- and Aluminum-Wire Bonding Designed for High-Temperature Applications

@inproceedings{Paste2000ElectrolessN,
  title={Electroless Nickel / Electroless Palladium / Immersion Gold Plating Process for Gold- and Aluminum-Wire Bonding Designed for High-Temperature Applications},
  author={Ag Paste and K. Johal and S. Lamprecht and H. Roberts},
  year={2000}
}
This paper summarizes the results of qualification testing of the Electroless Nickel / Electroless Palladium / Immersion Gold (Ni/Pd/Au) process as it may be applied for use in high-temperature functional applications. The effects of exposure to heated, high humidity environments were also examined, in addition to the impact of extended thermal cycling. 
9 Citations
Impact of Electroless Nickel / Palladium / Immersion Gold Plating on Gold Ball Bond Reliability
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Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications
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Nickel-palladium bond pads for copper wire bonding
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Thermosonic platinum wire bonding on platinum
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