Electroless Nickel / Electroless Palladium / Immersion Gold Process For Multi-Purpose Assembly Technology

@inproceedings{Johal2009ElectrolessN,
  title={Electroless Nickel / Electroless Palladium / Immersion Gold Process For Multi-Purpose Assembly Technology},
  author={Kuldip Johal and Hugh Roberts and Sven Lamprecht},
  year={2009}
}
As the second part to a paper presented at the 2004 SMTA Pan Pacific Symposium, this paper further summarizes the results from technical qualification of the Ni/Pd/Au process. Whereas the previous paper examined the wire bonding capabilities of this surface finish, this second paper focuses specific attention to BGA applications. In these investigations, the solder joint integrity is measured using ball shear testing of BGAs as test vehicles. Ball shear performance of BGA solder joints is… CONTINUE READING
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High Performance Coplanar Finishes for BGAs and High Density Substrates

  • Dr. Schreier, Burkhart
  • I-Au
  • 2000

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