Electro-thermal and logi-thermal simulation of VLSI designs

@article{Szkely1997ElectrothermalAL,
  title={Electro-thermal and logi-thermal simulation of VLSI designs},
  author={Vladim{\'i}r Sz{\'e}kely and Andr{\'a}s Poppe and Andras Pahi and Alpar Csendes and G. Hajas and M{\'a}rta Rencz},
  journal={IEEE Trans. VLSI Syst.},
  year={1997},
  volume={5},
  pages={258-269}
}
Due to severe thermal problems of today’s VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing. In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design. The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-A1 contacts… CONTINUE READING
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