Electrical measurement of plating thickness. Final report

  title={Electrical measurement of plating thickness. Final report},
  author={J. B. Mustapha},
A resistance-measuring system using a commercial microhmmeter and four-point probes effectively determines the thickness of copper foil and plating on samples with surface dimensions large in comparison to probe spacing. Individual probe-calibration conductance curves are required. Although comparable in resolution to beta-backscatter measurements, the measuring system is faster, easier to calibrate, less expensive, and requires less operator training time.