Electrical functionalization of thermoplastic materials by cold active atmospheric plasma technology

Abstract

Plasmadust® is a new technology using cold active plasma for additive metallization of different substrate materials. For electronics production, in particular Molded Interconnect Devices (MID), thermoplastic materials can be structured with copper as power electronic conductive pattern. The main advantages of Plasmadust® are the controllable… (More)

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Cite this paper

@article{Schramm2013ElectricalFO, title={Electrical functionalization of thermoplastic materials by cold active atmospheric plasma technology}, author={R{\"{u}diger Schramm and Jorg Franke}, journal={2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)}, year={2013}, pages={108-113} }