Electrical characterization method to study barrier integrity in 3D through-silicon vias

  title={Electrical characterization method to study barrier integrity in 3D through-silicon vias},
  author={Y.-L. Li and Dimitrios Velenis and Thomas Kauerauf and Michele Stucchi and Yann Civale and A. Redolfi and Kristof Croes},
  journal={2012 IEEE 62nd Electronic Components and Technology Conference},
In this paper, the controlled I-V (IVctrl) method is adopted for the barrier integrity characterization of TSVs at wafer level. Planar capacitor structures are used for the initial validation of the IVctrl method with respect to the traditional time dependent dielectric breakdown (TDDB) methodology. The TDDB field acceleration factor of the TSV liner is extracted by IVctrl in a reasonable time, and the results demonstrate that defective barriers can degrade TDDB field acceleration factor and… CONTINUE READING
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