Electrical Methods for Mechanical Characterization of Interconnect Thin Films

Abstract

We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in the materials system due to differences in thermal expansion between the metal and constraining substrate and… (More)

Topics

5 Figures and Tables

Cite this paper

@inproceedings{Keller2005ElectricalMF, title={Electrical Methods for Mechanical Characterization of Interconnect Thin Films}, author={Robert R. Keller and Cynthia A. Volkert and Roy H. Geiss and Andrew J. Slifka and David T. Read and Nicholas Barbosa and R. M{\"o}nig}, year={2005} }