Electric contact behavior of Cu-Sn intermetallic compound formed in tin platings

  title={Electric contact behavior of Cu-Sn intermetallic compound formed in tin platings},
  author={C. B. Shao and J. G. Zhang},
  journal={Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238)},
An intermetallic compound (IMC) Cu/sub 6/Sn/sub 5/ is formed in tin platings on phosphorous bronze substrates when the coupons are subjected to thermal shocks. The coupons were cross-sectioned to show the growth of Cu-Sn IMC which was identified by X-ray diffraction method. Sliding and fretting electric contact behavior were studied on such surfaces. Previous studies in other laboratories found that the contact resistance in such experiments was quite high. In the present experiments, however… CONTINUE READING
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