Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs

@article{Dieckerhoff2007ElectricCO,
  title={Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs},
  author={Sibylle Dieckerhoff and T. Kirfe and T. F. Wernicke and Christine Kallmayer and Andreas Ostmann and E. Jung and Bernhard Wunderle and Herbert Reichl},
  journal={2007 IEEE Power Electronics Specialists Conference},
  year={2007},
  pages={1036-1042}
}
In this paper, two planar interconnection technologies for power semiconductors - a Flip Chip solution with a flexible substrate and a Chip-in-Polymer approach - are presented. These technologies substitute the wire bonds which are usually applied to contact the top side pads of power semiconductors. The process flow of the technology developments is explained. Exemplarily, prototypes are built applying fast switching MOSFETs in the voltage class up to 100 V. Based on these prototypes… CONTINUE READING

Citations

Publications citing this paper.

References

Publications referenced by this paper.
Showing 1-10 of 12 references

Flip-Chip on Flex Integrated Power Electronics Modules for High-Density Power Integration

  • J. Bai, G. Lu, X. Liu
  • IEEE Transactions on Advanced Packaging,
  • 2003
Highly Influential
5 Excerpts

Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards

  • D Manessis, Yen, +4 authors H. Reichl
  • Proceedings in the IMAPS Nordic Annual Conference
  • 2007

New Structure of Power Integrated Module

  • M. Mermet-Guyennet
  • Conference on Integrated Power Electronics…
  • 2006
2 Excerpts

Performance Comparison of Advanced Power Electronic Packages for Automotive Applications

  • S. Dieckerhoff, S. Guttowski, H. Reichl
  • Proceedings of the Conference on Automotive Power…
  • 2006
2 Excerpts

Large Aluminum Ribbon Bonding: An Alternative Interconnect Solution for Power Module Applications

  • C. Luechinger
  • Proceedings of the International Symposium on…
  • 2004
1 Excerpt

Similar Papers

Loading similar papers…